Join us

Intel’s Knights Landing Leverages Technology Found in Micron’s HMC Devices

20 - 01 - 2017

Knights Landing, Intel’s next-generation Xeon Phi™ CPU architecture, leverages the fundamental DRAM and stacking technologies found in our Hybrid Memory Cube (HMC) products. This high-performance, on-package memory enables Knights Landing to provide industry-leading performance, energy efficiency, and the reliability, availability, and serviceability (RAS) capabilities essential to the success of high-performance computing (HPC) systems.